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Syenta

Enabling the transition to 2.5D and 3D chiplet stacking and increasing the performance of semiconductor chips to meet the growing demand.

Backed by

Wollemi Capital GroupWollemi Capital Group
SGInnovateSGInnovate
Our Innovation FundOur Innovation Fund
InvestibleInvestible
Jelix VenturesJelix Ventures
In-Q-TelIn-Q-Tel
Brindabella CapitalBrindabella Capital
Blackbird VenturesBlackbird Ventures
Salus VenturesSalus Ventures

Raised 8.8M SERIES_A on August 12, 2025

About

Syenta develops lithography-free localized electrochemical manufacturing and multi-material 3D printers that electrochemically deposit metals, semiconductors and conductive polymers to produce micron-scale, high-density interconnects for advanced chip packaging.

Mission

Syenta is a five-year-old ANU spin-out developing Localized Electrochemical Manufacturing (LEM), a lithography-free process that enables micron-scale, high-density interconnects for advanced chip packaging. LEM is designed to allow much denser and more precise wiring so memory and processors can sit closer together and exchange data faster and more efficiently, addressing the 'memory wall' throttling AI systems. The company emerged from stealth and built multi-material 3D printers, and previously raised a Blackbird-led $3.7 million Seed round in 2022. Last year Syenta was selected for ASTRA, Applied Materials' flagship accelerator, providing access to leaders in electroplating, global foundries, OSATs and materials companies. The latest $8.8 million pre-Series A will fund commercialisation of its chip-packaging technology to support next-generation AI and high-performance computing. Leadership positions LEM as a platform with the scale, performance and manufacturability needed for global semiconductor manufacturing. Syenta has developed a 3D printing technology platform that enables true multi-material printing and aims to transform electronics manufacturing. Its electrochemical deposition method can print metals, semiconductors and conductive plastics/polymers by converting dissolved material into solid material without using temperature or light. The approach is described as faster and more efficient than current methods and is additive rather than subtractive, reducing waste and improving sustainability. Syenta has raised $3.7 million in seed funding to drive production of its fast, efficient multi-material 3D printers. The founders are Professor Luke Connal and CEO Jekaterina Viktorova, who developed the technology at The Australian National University and previously operated as Spark3D. The company already has an industrial customer, GreatCell Energy, and plans to hire software engineers, pay contributing students and deliver its product to customers in Australia and worldwide.

Quick Facts

Founded

2022

Funding

SERIES_A

Industry

Manufacturing, Semiconductor

Team Size

11-50

Headquarters

Sydney, New South Wales, Australia